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NVIDIA HGX™ B300 NVL8 Liquid-Cooled AI Server (4U16X-GNR2/DLC B300)

4U ASRock Rack AI TRAINING / LLM / INFERENCE / HPC / LIQUID COOLING / AI FACTORY

4U16X-GNR2/DLC B300 是 ASRock Rack 的 4U 直接液冷 AI 伺服器,搭載 NVIDIA HGX B300 NVL8 GPU 模組,處理器採用 Intel Xeon 6(Granite Rapids)雙路平台。與 AMD 版本共用同一套液冷機構,差別在於 CPU 平台選擇——Intel 平台在單核效能與既有軟體相容性上較有優勢,適合已在 Intel 生態系上運作的資料中心無痛擴充。4U 內完成八卡 Blackwell Ultra 部署,搭配 NVLink 與 NVSwitch 全速互連,適合大型語言模型訓練、生成式 AI 推論與 AI Factory 建置。哲威電子為原廠授權代理商,提供選型建議、整機建置、到府安裝與後續維運服務,歡迎來信索取完整規格書與報價。

規格

Form Factor4U Rackmount
Dimensions919 x 435 x 175mm (36.2" x 17.1" x 6.9")
Support MotherboardSupport Motherboard
I/O Ports8 OSFP (800Gb/s) via NVIDIA® ConnectX®-8 SuperNIC™ 2 RJ45 (1GbE) by Intel i350, shares with Rear IO 1 dedicated IPMI, shares with Rear IO 4 Type-A (USB3.2 Gen1) 1 DB15 (VGA)
Front Side Drive Bay10 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays from PCIe Switch 2 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays from CPU
Internal Side1 M-key (PCIe5.0 x2), supports 22110/2280 form factor [CPU0]
Type5+5 CRPS
Output Watts3002.4W @ 220-240Vac input, 2900W @200-220Vac input
Efficiency80-PLUS Titanium
AC Input200-240Vrms, 50/60Hz
Fan2 PWM 80x80mm fans, 8 PWM 60x56 mm fans
GPUNVIDIA® HGX™ B300 NVL8
CPUSupports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
SocketDual Socket E2 (LGA 4710)
ChipsetSystem on Chip
Switch ICPEX89104
TopologySynthetic mode for optimized performance of GPU-to-CPU, GPUDirect RDMA NIC, and GPUDirect Storage
Supported DIMM Quantity16+16 DIMM slots (2DPC)
Supported TypeDDR5 RDIMM DDR5 RDIMM-3DS DDR5 MRDIMM
Max. Capacity per DIMMRDIMM: 128GB MRDIMM: 64GB
Max. DIMM FrequencyRDIMM: 6400MT/s (1DPC), 5200MT/s (2DPC) RDIMM-3DS: 6400MT/s (1DPC), 5200MT/s (2DPC) MRDIMM: 8000MT/s (1DPC only)* *Only available for Intel® Xeon® 6500P/6700P-series processors
Voltage1.1V
PCIe x 16Rear: 2 FHHL PCIe5.0 x16
Additional Ethernet ControllerIntel® i350: 2 RJ45 (1GbE)
UID Button/LED1 UID button w/ LED
Other Button/LED1 power button w/ LED
USB 3.2 Gen1 Port2 Type-A (USB3.2 Gen1)
RJ452 RJ45 (1GbE) by Intel® i350, shares with Front Panel 1 dedicated IPMI, shares with Front Panel
BIOS TypeAMI UEFI BIOS; 512Mb SPI Flash ROM
BIOS FeaturesPlug and Play, ACPI 4.0 and above compliance wake up events, SMBIOS 3.4 and above, ASRock Rack instant flash
TemperatureOperating temperature: 10°C ~ 35°C / Non-operating temperature: -40°C ~ 70°C
HumidityNon-operating humidity: 20% ~ 90% (non-condensing)

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