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NVIDIA HGX™ B300 NVL8 Liquid-Cooled AI Server (4U16X-GNR2/DLC B300)

4U ASRock Rack AI TRAINING / LLM / INFERENCE / HPC / LIQUID COOLING / AI FACTORY

The 4U16X-GNR2/DLC B300 is an ASRock Rack 4U direct-liquid-cooled AI server with the NVIDIA HGX B300 NVL8 GPU module on a dual-socket Intel Xeon 6 (Granite Rapids) platform. It shares the same liquid-cooling mechanism as the AMD version, differing only in CPU platform - Intel offers stronger single-core performance and existing software compatibility, making it a smooth expansion path for data centres already standardised on the Intel ecosystem. Eight-GPU Blackwell Ultra deployment in 4U with NVLink and NVSwitch full-speed interconnect suits large language model training, generative AI inference and AI Factory build-outs. JEI WEI ELECTRONIC is an authorised distributor providing configuration advice, complete system integration, on-site installation and ongoing support - contact us for the full datasheet and a quotation.

Specifications

Form Factor4U Rackmount
Dimensions919 x 435 x 175mm (36.2" x 17.1" x 6.9")
Support MotherboardSupport Motherboard
I/O Ports8 OSFP (800Gb/s) via NVIDIA® ConnectX®-8 SuperNIC™ 2 RJ45 (1GbE) by Intel i350, shares with Rear IO 1 dedicated IPMI, shares with Rear IO 4 Type-A (USB3.2 Gen1) 1 DB15 (VGA)
Front Side Drive Bay10 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays from PCIe Switch 2 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays from CPU
Internal Side1 M-key (PCIe5.0 x2), supports 22110/2280 form factor [CPU0]
Type5+5 CRPS
Output Watts3002.4W @ 220-240Vac input, 2900W @200-220Vac input
Efficiency80-PLUS Titanium
AC Input200-240Vrms, 50/60Hz
Fan2 PWM 80x80mm fans, 8 PWM 60x56 mm fans
GPUNVIDIA® HGX™ B300 NVL8
CPUSupports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
SocketDual Socket E2 (LGA 4710)
ChipsetSystem on Chip
Switch ICPEX89104
TopologySynthetic mode for optimized performance of GPU-to-CPU, GPUDirect RDMA NIC, and GPUDirect Storage
Supported DIMM Quantity16+16 DIMM slots (2DPC)
Supported TypeDDR5 RDIMM DDR5 RDIMM-3DS DDR5 MRDIMM
Max. Capacity per DIMMRDIMM: 128GB MRDIMM: 64GB
Max. DIMM FrequencyRDIMM: 6400MT/s (1DPC), 5200MT/s (2DPC) RDIMM-3DS: 6400MT/s (1DPC), 5200MT/s (2DPC) MRDIMM: 8000MT/s (1DPC only)* *Only available for Intel® Xeon® 6500P/6700P-series processors
Voltage1.1V
PCIe x 16Rear: 2 FHHL PCIe5.0 x16
Additional Ethernet ControllerIntel® i350: 2 RJ45 (1GbE)
UID Button/LED1 UID button w/ LED
Other Button/LED1 power button w/ LED
USB 3.2 Gen1 Port2 Type-A (USB3.2 Gen1)
RJ452 RJ45 (1GbE) by Intel® i350, shares with Front Panel 1 dedicated IPMI, shares with Front Panel
BIOS TypeAMI UEFI BIOS; 512Mb SPI Flash ROM
BIOS FeaturesPlug and Play, ACPI 4.0 and above compliance wake up events, SMBIOS 3.4 and above, ASRock Rack instant flash
TemperatureOperating temperature: 10°C ~ 35°C / Non-operating temperature: -40°C ~ 70°C
HumidityNon-operating humidity: 20% ~ 90% (non-condensing)

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